Author: Winkleman, Adam; Perez-Castillejos, Raquel; Lahav, Michal; Narovlyansky, Max; Rodriguez, Leonard N J; Whitesides, George M
Title: Patterning micron-sized features in a cross-linked poly(acrylic acid) film by a wet etching process. Cord-id: qfb9i5io Document date: 2006_12_13
ID: qfb9i5io
Snippet: This paper describes a photolithographic method to create sub-micron-scale patterns of cation-cross-linked poly(acrylic acid) (CCL-PAA). PAA can be cross-linked with a wide range of metal cations-including, but not limited to, Ag, Ca, Pd, Al, La, and Ti. Upon patterning a positive photoresist (diazonaphthoquinone-novolac resin) on a film of CCL-PAA, the exposed regions of CCL-PAA were etched by either an aqueous NaOH or EDTA solution. The initial cross-linking cation could be exchanged for a sec
Document: This paper describes a photolithographic method to create sub-micron-scale patterns of cation-cross-linked poly(acrylic acid) (CCL-PAA). PAA can be cross-linked with a wide range of metal cations-including, but not limited to, Ag, Ca, Pd, Al, La, and Ti. Upon patterning a positive photoresist (diazonaphthoquinone-novolac resin) on a film of CCL-PAA, the exposed regions of CCL-PAA were etched by either an aqueous NaOH or EDTA solution. The initial cross-linking cation could be exchanged for a second cation that could not be patterned photolithographically. We used these patterned films of CCL-PAA i) to host and template the reduction of metallic cations to metallic nanoparticles, and ii) to fabricate porous, low- dielectric substrates.
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