Author: Narvaez Villarrubia, Claudia W.; Tumas, Keyla C.; Chauhan, Rajat; MacDonald, Thomas; Dattelbaum, Andrew M.; Omberg, Kristin; Gupta, Gautam
Title: Long-term stabilization of DNA at room temperature using a one-step microwave assisted process Cord-id: 34hetqg4 Document date: 2021_3_23
ID: 34hetqg4
Snippet: Long-term stabilization of DNA is needed for forensic, clinical, in-field operations and numerous other applications. Although freezing (<−20 °C) and dry storage are currently the preferential methods for long-term storage, a noticeable pre-analytical degradation of DNA over time, upfront capital investment and recurring costs have demonstrated a need for an alternative long-term room-temperature preservation method. Herein, we report a novel, fast (~5 min) silica sol–gel preparation method
Document: Long-term stabilization of DNA is needed for forensic, clinical, in-field operations and numerous other applications. Although freezing (<−20 °C) and dry storage are currently the preferential methods for long-term storage, a noticeable pre-analytical degradation of DNA over time, upfront capital investment and recurring costs have demonstrated a need for an alternative long-term room-temperature preservation method. Herein, we report a novel, fast (~5 min) silica sol–gel preparation method using a standard microwave-initiated polymerization reaction amenable to stabilization of DNA. The method involves use of one chemical, tetramethoxy silane (TMOS) and eliminates the use of alcohol as co-solvent and catalysts such as acids. In addition, the process involves minimal technical expertise, thus making it an ideal choice for resource-challenged countries and in-field applications. The sol–gel is capable to store and stabilize Escherichia coli DNA in ambient conditions for 210 days. DNA recovered from the sol–gel showed no significant nucleolytic and/or oxidative degradation, outperforming conventional storage conditions at −20 °C, and reported state-of-the-art technology. SUPPLEMENTARY INFORMATION: The online version contains supplementary material available at 10.1007/s42247-021-00208-3.
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